Dr. rer. nat. Sonja Koller, Diplom-Physikerin (Universität Regensburg)
in LinkedIn-Profil
Meine Kompetenzen
Simulationen und Modellierung | Wärmetransport und Kühlung
Analytische Modelle | Approximationen
Python | Matlab | VB Excel | HTML/Javascript | C++ | Java | .NET
Webdesign | Layout-/Textsatz | CAD
Erfindungsmeldungen | Patente
Machine Learning
Halbleiter-Gehäusetechnologien
Physik | Quantenpunkte | Spin- und Ladungstransport
Meine beruflichen Aktivitäten - Kurzzusammenfassung:
| seit August 2023 | - | freiberuflich tätig |
| Jan. 2012 - Aug. 2023 | - | Intel Deutschland GmbH
Expertin für thermische Simulationen von Halbleiterbauelementen in verschiedenen Systemen. Optimierte Kühllösungen, Lösungen zur Verhinderung von thermischem Durchgehen, R-C-Kompaktmodelle für schnellere Vorhersagen. Schnelle Abschätzung von Zuverlässigkeitsfragen dank Entwicklung analytischer Modelle und/oder machine learning. Erfindungen und daraus 39 Patente im Bereich der Halbleiter-Gehäuseentwicklung.
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| 2015/2016 | - | OTH Regensburg
Vorlesung (Physik für Maschinenbauer) und Praktikumsbetreuung im Rahmen eines Lehrauftrags. |
| Dez. 2011 - Okt. 2010 | - | Infineon Technologies AG
Trainee Gehäuseentwicklung, Leadframe-Gehäusedesign (AutoCAD), Softwaretests Design-Automatisierung, Herstellerkommunikation zur Fehlerbehebung und Verbesserung der Funktionalität, Einführung der Software, Training der Anwender. |
| Dez. 2006 - Sept. 2010 | - | Universität Regensburg
Doktorandin/Post-doc theoretische Festkörperphysik, Berechnung von Spin- und Ladungstransport über Nanostrukturen - siehe meine Publikationen.
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Meine Patente:
Three-dimensional stack cooling wingsSonja Koller, Vishnu Prasad, Bernd Waidhas, Eduardo De Mesa, Lizabeth Keser, Thomas Wagner, Mohan Prashanth Javare Gowda, Abdallah Bacha, Jan Proschwitz
17/709,481 - Filed 31 March 2022
Heterogeneous packages having thermal towersVishnu Prasad, Abdallah Bacha, Mohan Prashanth Javare Gowda, Lizabeth Keser, Thomas Wagner, Bernd Waidhas, Sonja Koller, Eduardo De Mesa, Jan Proschwitz
17/708,890 - Filed 30 March 2022
Integrated circuit packages having reduced z-height and heat pathJan Proschwitz, Sonja Koller, Thomas Wagner, Vishnu Prasad, Wolfgang Molzer
17/700,211 - Filed 21 March 2022
Microelectronic assemblies including stiffeners around individual diesPouya Talebbeydokhti, Mohan Prashanth Javare Gowda, Sonja Koller, Stephan Stoeckl, Thomas Wagner, Wolfgang Molzer
17/699,139 - Filed 20 March 2022
Packaging architecture with thermally conductive integrated circuit bridgeBernd Waidhas, Sonja Koller, Jan Proschwitz, Eduardo De Mesa
17/698,282 - Filed 18 March 2022
Packaging architecture with active coolingBernd Waidhas, Sonja Koller, Jan Proschwitz, Eduardo De Mesa
17/685,496 - Filed 03 March 2022
Stacked die packaging architecture with conductive vias on interposerThomas Wagner, Abdallah Bacha, Vishnu Prasad, Mohan Prashanth Javare Gowda, Bernd Waidhas, Sonja Koller, Eduardo De Mesa, Jan Proschwitz, Lizabeth Keser
17/685,871 - Filed 03 March 2022
Packaging architecture with reinforcement structure in package substrateMohan Prashanth Javare Gowda, Stephan Stoeckl, Thomas Wagner, Sonja Koller, Wolfgang Molzer, Pouya Talebbeydokhti
17/679,185 - Filed 24 February 2022
Single metal cavity antenna in package connected to an integrated transceiver front-endSonja Koller, Kilian Roth, Josef Hagn, Andreas Wolter, Andreas Augustin
16/421,315 - Filed 23 May 2019
Package integrated cavity resonator antenna
Kilian Roth, Sonja Koller, Josef Hagn, Andreas Wolter, Andreas Augustin
16/414,356 - Filed 16 May 2019, Granted 09 May 2023
Power mesh-on-die trace bumpingBernd Waidhas, Sonja Koller, Georg Seidemann
16/298,680 - Filed 11 March 2019, Granted 21 April 2020
Integrated circuit devices with front-end metal structures
Reinhard Mahnkopf, Sonja Koller, Andreas Wolter
16/641,241 - Filed 26 June 2018, Granted 09 August 2022
Thermal contacts at periphery of integrated circuit packages
Sonja Koller, Vishnu Prasad, Georg Seidemann
16/015,334 – Filed 22 June 2018
Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor deviceSonja Koller, Georg Seidemann, Bernd Waidhas
15/935,128 - Filed 26 March 2018, Granted 19 May 2020
Electromagnetic shielding cap, an electrical system and a method for forming an electromagnetic shielding capSonja Koller, Saravana Maruthamuthu, Bernd Waidhas
15/933,402 - Filed 23 March 2018
Wearable computing deviceSven Albers, Klaus Reingruber, Teodora Ossiander, Andreas Wolter, Sonja Koller, Georg Seidemann, Jan Proschwitz, Hans-Joachim Barth, Bastiaan Elshof
15/879,729 – Filed 25 January 2018
Thermal conduction devices and methods for embedded electronic devices
Sonja Koller, Bernd Waidhas, Thomas Ort, Andreas Wolter
15/866,810 – Filed 10 January 2018
Interposer with angled viasSonja Koller, Lizabeth Keser, Bernd Waidhas, Georg Seidemann
15/857,207 – Filed 28 December 2017
Anisotropically conductive elastic adhesive films in semiconductor device packages and methods of assembling sameSonja Koller, Georg Seidemann, Bernd Waidhas
15/852,908 – Filed 22 December 2017
Semiconductor devices, and a method for forming a semiconductor device
Reinhard Mahnkopf, Andreas Wolter, Sonja Koller
15/719,653 - Filed 29 September 2017, Granted 14 January 2020
Semiconductor packages, and methods for forming semiconductor packages
Bernd Waidhas, Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin, Sonja Koller, Thomas Ort, Reinhard Mahnkopf
16/641,241 - Filed 29 September 2017
Printed wiring-board islands for connecting chip packages and methods of assembling sameGeorg Seidemann, Sonja Koller, Bernd Waidhas
16/642,801 – Filed 29 September 2017, Granted 28 September 2021
Smart accelerometer cantilever
Sonja Koller, Bernd Waidhas, Georg Seidemann, Stephan Stoeckl
15/638,590 – Filed 30 June 2017
Integrated circuit package configurations to reduce stiffness
Sven Albers, Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter
15/590,890 – Filed 09 May 2017, Granted 06 August 2019
Patch antennas stitched to systems in packages and methods of assembling sameAndreas Augustin, Sonja Koller, Bernd Waidhas, Georg Seidemann, Andreas Wolter, Stephan Stoeckl, Thomas Wagner, Josef Hagn
16,473,566 – Filed 31 March 2017, Granted 28 June 2022
Filler interface heat transfer system and devices and methods for same
Georg Seidemann, Bernd Waidhas, Thomas Wagner, Andreas Wolter, Sonja Koller, Vishnu Prasad
15/475,368 – Filed 31 March 2017
Magnetic coils in locally thinned silicon bridges and methods of assembling sameAndreas Augustin, Bernd Waidhas, Sonja Koller, Reinhard Mahnkopf, Georg Seidemann
16/474,015 – Filed 30 March 2017, Granted 27 September 2022
Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatusSonja Koller, Reinhard Mahnkopf
16/467,582 – Filed 30 December 2016, Granted 15 June 2021
Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatusSonja Koller, Georg Seidemann, Reinhard Mahnkopf, Bernd Waidhas
16/349,359 – Filed 29 December 2016, Granted 12 October 2021
Device with switchable heat path
Sonja Koller, Georg Seidemann, Vishnu Prasad
15/386,905 – Filed 21 December 2016, Granted 02 October 2018
Flip-chip package with thermal dissipation layer
Richard Patten, Bernd Waidhas, Sonja Koller
14/977,307 – Filed 21 December 2015
Interposer with conductive routing exposed on sidewalls
Klaus Reingruber, Christian Geissler, Georg Seidemann, Sonja Koller
15/778,410 – Filed 18 December 2015, Granted 12 May 2020
Low thermal resistance hanging die package
Christian Geissler, Georg Seidemann, Sonja Koller, Jan Proschwitz
15/748,475 – Filed 31 August 2015, Granted 09 July 2019
Cooler for semiconductor devices
Sven Albers, Klaus Reingruber, Andreas Wolter, Georg Seidemann, Christian Geissler, Alexander Atzesdorfer, Sonja Koller
14/839,510 – Filed 28 August 2015, Granted 06 November 2018
Contact pads for integrated circuit packages
Sven Albers, Georg Seidemann, Sonja Koller, Stephan Stoeckl, Shubhada H. Sahasrabudhe, Sandeep B. Sane
14/280,110 – Filed 16 May 2014, Granted 29 March 2016
Meine Publikationen:
Sources of negative tunneling magnetoresistance in multilevel quantum dots with ferromagnetic contacts
Sonja Koller, Milena Grifoni, and Jens Paaske
Phys. Rev. B 85, 045313 – Published 13 January 2012
Dynamical symmetry breaking in vibration-assisted transport through nanostructures
Abdullah Yar, Andrea Donarini, Sonja Koller, and Milena Grifoni
Phys. Rev. B 84, 115432 – Published 21 September 2011
Density-operator approaches to transport through interacting quantum dots: Simplifications in fourth-order perturbation theory
S. Koller, M. Grifoni, M. Leijnse, and M. R. Wegewijs
Phys. Rev. B 82, 235307 – Published 3 December 2010
Inelastic cotunneling in quantum dots and molecules with weakly broken degeneracies
Georg Begemann, Sonja Koller, Milena Grifoni, and Jens Paaske
Phys. Rev. B 82, 045316 – Published 23 July 2010
Spin-dependent transport through interacting graphene armchair nanoribbons
Sonja Koller, Leonhard Mayrhofer, and Milena Grifoni
New J. Phys. 12 033038 - Published 23 March 2010
Graphene armchair nanoribbon single-electron transistors: The peculiar influence of end states
S. Koller, L. Mayrhofer, and M. Grifoni
EPL 88 57001 - Published 7 December 2009
Exchange effects in spin-polarized transport through carbon nanotube quantum dots
Christoph Schenke, Sonja Koller, Leonhard Mayrhofer, and Milena Grifoni
Phys. Rev. B 80, 035412 – Published 10 July 2009
Transport through a double-quantum-dot system with noncollinearly polarized leads
R. Hornberger, S. Koller, G. Begemann, A. Donarini, and M. Grifoni
Phys. Rev. B 77, 245313 – Published 12 June 2008
Spin transport across carbon nanotube quantum dots
Sonja Koller, Leonhard Mayrhofer, and Milena Grifoni
New J. Phys. 9 348 - Published 28 September 2007